Mechanical Engineering, Indian Institute of
Science, Bangalore 560 012, India
Think big about small things!
ME237
Introduction to MEMS
Jan.-Apr. 2005
Instructor: G. K.
Ananthasuresh, Room 106, ME Building, suresh at
mecheng.iisc.ernet.in
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Homework #3
Assigned: Jan. 18th, 2005
Due: Jan. 25th, 2005
Points: 20
Please look at CombdriveFab.pdf
and CombdriveDesLevels.pdf
before you begin to work on this homework. Try to follow this format
as much as possible. Anything more you do or any better way you will
present this will be appreciated and rewarded with extra marks.
-
10 points
For the MEMS device/component assigned to you, research the literature and
learn about the micromachining process used to make it. And, then submit
the following.
- Verbal description of the process
- Process flow (step-by-step cross-section figures)
- Mask layouts for the etching steps (to the extent possible)
-
10 points
We discussed the four hierarchical levels of the MEMS design process.
Discuss those levels as follows for your device/component. Based on the papers you have read, give quantitative
information for each level--again as much as you can do it.
- System level: Draw a high-level block diagram that describes your
device/component idetifying each block. For this, try to ask the pertinent
questions at the system level.
- Device level: Draw the block diagram that describes the dynamics of
any one significant moving solid device/component in your case.
- Physical level: What are the phenomena that are most important to
your selected component/device? Write the governing equations if you can.
What are the design objectives and constraints that determine the geometry
of parts of the component/device?
- Process level: Is the process chosen for your device/component by
the authors of the papers of your device/component justificable? That is,
if they used surface micromachining, is that what they should use, or
something else? Mention at least one other process to make your selected
component/device.