Mechanical Engineering, Indian Institute of
Science, Bangalore 560 012, India
Think big about small things!
ME237
Mechanics of Microsystems
Aug. -Dec., 2010
Instructors:
G. K.
Ananthasuresh, Room 106, ME Building, suresh at
mecheng.iisc.ernet.in
Back to homepage of the course
Homework #5
Assigned: Sep. 21st, 2010
Due: Sep. 28th, 2010
Points: 50
-
50 points
You have 50 mm2 area on a chip. The thickness of the structural layer that you can anchor, etch away, or suspend is 25 um. Design a suspension
that gives as much static displacement as possible along an in-plane axis under 1 g (=9.81 m/s2) acceleration load along the same axis.
The following conditions must be obeyed.
-
Use the following material properties: Y = Young's modulus; 159 GPa, nu = Poisson's ratio = 0.25; rho = material density = 2300 kg/m3
-
The stiffness of the suspension in the in-plane cross-axis must be 50 times larger than that in the acceleration axis.
-
Anchor pads must be larger than 100 um by 100 um squares.
-
In-plane beam width must be larger than 5 um, and the beam length cannot be more than 600 um.
-
Smallest in-plane gap should be larger than 4 um.
Please submit the full details of your design with a neat sketch and properly marked dimensions. Provide the analysis details that you used to
arrive at your design.