ME Seminar
“Thermal Innovation for Future Chips”
Venue: November 5, 2021, 4:00 PM, Online through Microsoft TeamsÂ
Speaker: Dr. Bai Song, Peking University, Beijing, China
Abstract and Biography of the Speaker
“Thermal Innovation for Future Chips”
Venue: November 5, 2021, 4:00 PM, Online through Microsoft TeamsÂ
Speaker: Dr. Bai Song, Peking University, Beijing, China
Abstract and Biography of the Speaker